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±¸µ¿ •IC °³¹ß (D-IC, DDI, Power, Controller, TSP)
•3D±¸µ¿, PCB¼³°è
•T-CON, IP °³¹ß (S/W IP, H/W IP)
•¿µ»ó/½Åȣó¸®¾Ë°í¸®Áò, Panel Ư¼ºÇâ»ó ¾Ë°í¸®Áò Ôõ
Àç·á •À¯±âELÀç·á, SolubleÀç·á, Á¡ÂøÀç Àç·áÇÕ¼º °³¹ß ¹× Æò°¡
•C/FÀç·á, Àüµµ¼º ¹°Áú, ¾×Á¤, ¹èÇ⸷, Sealant
•Flexible Window, Film, AF Coating, Æí±¤ÆÇ Àç·á Ôõ
PANEL •Device ¼³°è, Circuit Design
•Æ¯¼ºÇâ»ó, °øÁ¤°³¹ß
•±¤Çм³°è Ôõ
CAE •¼ÒÀÚ/ÆгΠ±¸Á¶Çؼ® ¹× Simulation
•Çȼ¿/ÈÁú/À¯±âÀç·á ¼ö¸í ¿¹Ãø ¹× Simulation
•¿, º¯Çü/Áøµ¿, ÀüÀÚÀå, ±¤ÇÐ Çؼ®
•MCAD, CAE ½Ã½ºÅÛ°³¹ß
°øÁ¤/¼³ºñ •°øÁ¤ÃÖÀû°ú ¹× ºÒ·®°³¼±, ¾ç»ê¼º °ËÁõ/¼öÀ²¾ÈÁ¤È
•MES(Manufacturing Execution System)/
MIS(Manufacturing Information System)
¿î¿µ ¹× ½Ã½ºÅÛ ÃÖÀûÈ
•Áø°ø/ÁõÂø¼³ºñ(Display, ¹ÝµµÃ¼ ¼³ºñ), ¼³ºñ¾ç»ê¼º °ËÁõ
•¼³ºñÁ¦¾î, S/WÇ÷§Æû °³¹ß Ôõ
Laser/±¤ÇÐ •Laser ÀÀ¿ë Cutting/Å»Âø/Patterning ±â¼ú
•Laser Source ¹× ±¤ÇÐ°è ±â¼ú Ôõ
•¹Ú¸· ±¤ÇÐ (Thin Film Optics)
•¼³ºñ Ò® ±¤ÇÐ°è ¼³°è ¹× °³¹ß Ôõ
Á¦Ãâ¼·ù : À̷¼ (°æ·ÂÁß½É)
Tel. +822 538-7504
mail : ksy@smart-hr.co.kr
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